Embedded coin PCB
Structure：Partially / fully embedded
Min coin size ：2*2（mm)
Min coin thickness：0.5mm
Flatness between coin and base material ：≤0.075mm
Patrially embedded AIN board
Material：AIN
Embedded Ceramic size ：20*20（mm)
Professional technical support for thermal management：
Thick copper power supply
Material ：High TG, high thermal conductivity material
Dielectric thickness ：≥0.09mm
Inner layer copper：≤18 OZ
Max layer count ：24 layers
Featured product：Thick copper stepped board
Backplane
Max board size：1100mm X 610mm
Max board thickness：6.5mm
Max aspect ratio：25:1
High speed back drill PCB
Material：Panasonic, TUC, Isola
Barck drill accurancy：≤0.15mm
Technologies：Back drill + resin filling
Back drill board thickness：≤6.5mm
Bus-bar PCB
Bus bar material ：Pure copper
Min conductor space：0.8mm
Copper thickness ：1.0mm-3.0mm
Board thickness：2.0mm-10.0mm
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mgytea.com
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