Stepped G/F board
Board thickness：rn≥2.0mm
G/F thickness：≤1.6mm±0.1mm
G/F tolerance：±0.05mm
Layer count ：≤44 layers
Embedded coin PCB
Structure ：Partially / fully embedded
Min coin size：2*2（mm)
Min coin thickness ：0.5mm
Flatness between coin and base material：≤0.075mm
Patrially embedded AIN board
Material：AIN
Embedded Ceramic size：20*20（mm)
Professional technical support for thermal management：
IC test board
Max board thickness：6.0mm
Max aspect ratio：25:1
Max gold thickness：80 u''
Warpage ：≤4‰
Partially embedded AIN board
Material：AIN
Embedded Ceramic size ：20*20（mm)
Professional technical support for thermal management：
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mgytea.com
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